rubex
06-08-2003, 17:31
http://www.twinmos.com/dram/images/photo_twister_dualchannel_kit.jpg
The company named the new product line - TwiSTER after the core concepts incorporated into the technology with "S" standing for "speed" and "TER" standing for "terrific" to approach over-clocking power usersĦBgaming enthusiasts and business customers with its high performance and speedy yet steady retrieval of data. The DDR WLCSP module under the TwiSTER line is produced with WLCSP technology, enabling steady data transmission and effective thermal reduction.
WLCSP: Wafer-level chip scale packaging, refers to the packaging of the entire wafer instead of individual chips diced from the wafer -- a technique producing packaged chips 20% larger than the original. WLCSP involves packaging the entire wafer before the dicing process, producing packaged chips the same size as the original. http://www.twinmos.com/about/press/wlcsp-chip.jpg
M2G4I08A-TwisTER 333 MHz CL 2 256MB
M2G4J16A-TwisTER 333 MHz CL 2 512MB
M2GDI08A-TwisTER 400 Mhz CL2 256MB
M2GDJ16A-TwisTER 400 Mhz CL2 512MB
M2G9I08A-TwisTER 400 Mhz CL2.5 256MB
M2G9J16A-TwisTER 400 Mhz CL2.5 512MB
M2GII08A-TwisTER 433 MHz CL2 256MB
M2GIJ16A-TwisTER 433 MHz CL2 512MB
M2GEI08A-TwisTER 433 MHz CL2.5 256MB
M2GEJ16A-TwisTER 433 MHz CL2.5 512MB
M2GGI08A-TwisTER 466 Mhz CL2,5 256MB
M2GGJ16A-TwisTER 466 Mhz CL2,5 512MB
M2GHI08A-TwisTER 500 MHz CL 2.5 256MB/512MB
Dual Channel Kits 400 Mhz CL2 512MB
Dual Channel Kits 400 Mhz CL2 1G
Dual Channel Kits 400 Mhz CL2.5 512MB
Dual Channel Kits 400 Mhz CL2.5 1G
BYe
The company named the new product line - TwiSTER after the core concepts incorporated into the technology with "S" standing for "speed" and "TER" standing for "terrific" to approach over-clocking power usersĦBgaming enthusiasts and business customers with its high performance and speedy yet steady retrieval of data. The DDR WLCSP module under the TwiSTER line is produced with WLCSP technology, enabling steady data transmission and effective thermal reduction.
WLCSP: Wafer-level chip scale packaging, refers to the packaging of the entire wafer instead of individual chips diced from the wafer -- a technique producing packaged chips 20% larger than the original. WLCSP involves packaging the entire wafer before the dicing process, producing packaged chips the same size as the original. http://www.twinmos.com/about/press/wlcsp-chip.jpg
M2G4I08A-TwisTER 333 MHz CL 2 256MB
M2G4J16A-TwisTER 333 MHz CL 2 512MB
M2GDI08A-TwisTER 400 Mhz CL2 256MB
M2GDJ16A-TwisTER 400 Mhz CL2 512MB
M2G9I08A-TwisTER 400 Mhz CL2.5 256MB
M2G9J16A-TwisTER 400 Mhz CL2.5 512MB
M2GII08A-TwisTER 433 MHz CL2 256MB
M2GIJ16A-TwisTER 433 MHz CL2 512MB
M2GEI08A-TwisTER 433 MHz CL2.5 256MB
M2GEJ16A-TwisTER 433 MHz CL2.5 512MB
M2GGI08A-TwisTER 466 Mhz CL2,5 256MB
M2GGJ16A-TwisTER 466 Mhz CL2,5 512MB
M2GHI08A-TwisTER 500 MHz CL 2.5 256MB/512MB
Dual Channel Kits 400 Mhz CL2 512MB
Dual Channel Kits 400 Mhz CL2 1G
Dual Channel Kits 400 Mhz CL2.5 512MB
Dual Channel Kits 400 Mhz CL2.5 1G
BYe