thegambler
18-02-2010, 10:20
vendo processore q8200 nuovo ancora nella sua confezione originale,mai aperto !!! luogo in cui si trova il processore caserta, spedizione con pacco celere 3 10 euro. prezzo processore 125,00 euro
per qualsiasi info contattatemi....vendo anke altri processori e mainboard... contattatemi se vi dovesse servire qualkosa,inserisco topic di vendita e inserisco prezzo....
specifiche tecniche
General information
Type
CPU / Microprocessor
Family
Intel Core 2 Quad
Model number
Q8200
Part number
AT80580PJ0534MN
Step
R0
Frequency (MHz)
2333
Bus speed (MHz)
1333
Clock multiplier
7
Package
775-land Flip-Chip Land Grid Array (FC-LGA8)
1.48" x 1.48" (3.75 cm x 3.75 cm)
Socket
Socket 775 (LGA775)
Introduction date
Aug 31, 2008
Architecture / Microarchitecture
Processor core
Yorkfield
Manufacturing process
0.045 micron
Data width
64 bit
Number of cores
4
Floating Point Unit
Integrated
Level 1 cache size
4 x 32 KB instruction caches
4 x 32 KB data caches
Level 2 cache size
2 x 2 MB 12-way set associative caches (each L2 cache is shared between 2 cores)
Features
MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1
EM64T technology
Execute Disable Bit technology
Low power features
Enhanced SpeedStep technology
Stop Grant state
Halt state
Extended Halt state
Extended Stop Grant State
Sleep state
Deep Sleep state
Deeper Sleep state
Electrical/Thermal parameters
V core (V)
0.85 - 1.3625
Max operating temperature (°C)
71.4
Min/Max power dissipation (W)
12 (TDP in extended HALT state) / 132.48
Thermal Design Power (W)
95
per qualsiasi info contattatemi....vendo anke altri processori e mainboard... contattatemi se vi dovesse servire qualkosa,inserisco topic di vendita e inserisco prezzo....
specifiche tecniche
General information
Type
CPU / Microprocessor
Family
Intel Core 2 Quad
Model number
Q8200
Part number
AT80580PJ0534MN
Step
R0
Frequency (MHz)
2333
Bus speed (MHz)
1333
Clock multiplier
7
Package
775-land Flip-Chip Land Grid Array (FC-LGA8)
1.48" x 1.48" (3.75 cm x 3.75 cm)
Socket
Socket 775 (LGA775)
Introduction date
Aug 31, 2008
Architecture / Microarchitecture
Processor core
Yorkfield
Manufacturing process
0.045 micron
Data width
64 bit
Number of cores
4
Floating Point Unit
Integrated
Level 1 cache size
4 x 32 KB instruction caches
4 x 32 KB data caches
Level 2 cache size
2 x 2 MB 12-way set associative caches (each L2 cache is shared between 2 cores)
Features
MMX instruction set
SSE
SSE2
SSE3
Supplemental SSE3
SSE4.1
EM64T technology
Execute Disable Bit technology
Low power features
Enhanced SpeedStep technology
Stop Grant state
Halt state
Extended Halt state
Extended Stop Grant State
Sleep state
Deep Sleep state
Deeper Sleep state
Electrical/Thermal parameters
V core (V)
0.85 - 1.3625
Max operating temperature (°C)
71.4
Min/Max power dissipation (W)
12 (TDP in extended HALT state) / 132.48
Thermal Design Power (W)
95